Flip-Chip: Enabling technologies and solutions for packaging of microsystems ...

Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode)-Enabling technologies and solutions for packaging of microsystems, including microelectronics

... "In this area, our focus is on concurrent electrical, thermal and mechanical modeling of flip-chip, ball grid array (BGA) and chip scale packaging technologies. Typical projects include (i) experimental and computational analysis of area array packages; (ii) solder self-alignment for packaging; (iii) thermosonic flip-chip bonding; (iv) novel metal-foam heat sinks for thermal management of electronic systems up to 100 W/cm2; and (v) characterization of laminate substrates for flip-chip and surface mount technologies." ...